美國(guó)LAIRD吸收材料ECCOSTOCK? FFP
One part, epoxy based, free flowing powder
Eccostock FFP is a low loss, one part, epoxy based free flowing powder that cures to a rigid non-burning syntactic foam. Eccostock FFP is designed to infiltrate densely populated electronic packages, readily filling void space around components when vibrated in place. It can be used to stabilize crystal oscillators as well as other delicate components that need to be held in place or thermally protected. It may also be used in machinery operating in high vibration environments to minimize damage to electrical components.
Eccostock FFP is extremely lightweight and provides physical support as well as thermal insulation without increasing the weight or affecting the dielectric constant. During cure, its shrinkage is negligible exerting minimal stress on delicate components. Cure can be accomplished at temperatures as low as 100°C, but higher temperatures will shorten the cure cycle time.
美國(guó)LAIRD吸收材料ECCOSTOCK? FFP
One part, epoxy based, free flowing powder
Eccostock FFP是一種低損耗，單組分，基于環(huán)氧樹(shù)脂的自由流動(dòng)的粉末，可固化成堅(jiān)硬的非燃燒合成泡沫。Eccostock FFP被設(shè)計(jì)用來(lái)滲透人口稠密的電子封裝，當(dāng)振動(dòng)到位時(shí)，可以很容易地填充組件周?chē)目障犊臻g。它可以用來(lái)穩(wěn)定晶體振蕩器以及需要固定在位或受到熱保護(hù)的其他敏感元件。它也可以用在高振動(dòng)環(huán)境下的機(jī)器中，以最大限度地減少對(duì)電子元件的損壞。
Eccostock FFP是非常輕量級(jí)的，并提供物理支持以及絕熱而不增加重量或影響介電常數(shù)。在固化過(guò)程中，其收縮率可以忽略不計(jì)，對(duì)微妙的部件施加最小的應(yīng)力。固化可以在低至100°C的溫度下完成，但更高的溫度將縮短固化周期時(shí)間。
美國(guó)LAIRD吸收材料ECCOSTOCK? FFP典型參數(shù)特性
APPLICATIONS
? Eccostock FFP is designed to infiltrate densely populated electronic packages, readily filling available volumes around components. It been used to stabilize crystal oscillators as well as other delicate components that need to be held in place or thermally protected.
? Eccostock FFP has also found its way into machinery operating in high vibration environments to keep electrical components from shaking apart. ? Low shrinkage during cure makes
? Eccostock FFP excellent for encapsulation applications.
應(yīng)用
?Eccostock FFP旨在滲透人口密集的電子包裝，隨時(shí)填充組件周?chē)目捎镁怼?它被用來(lái)穩(wěn)定晶體振蕩器以及其他微妙的組件，需要保持在位或熱保護(hù)。
?Eccostock FFP也進(jìn)入了高振動(dòng)的機(jī)器中
以防止電氣組件發(fā)生搖晃。
?固化過(guò)程中收縮率低
Eccostock FFP非常適合封裝應(yīng)用。
美國(guó)LAIRD吸收材料ECCOSTOCK? FFP
愛(ài)澤工業(yè)(IZE INDUSTRIES)特價(jià)經(jīng)銷(xiāo)、常用備件型號(hào)：
LAIRD吸收材料ECCOSTOCK? LoK
LAIRD吸收材料ECCOSTOCK? FFP
LAIRD吸收材料ECCOSTOCK? PP
LAIRD吸收材料ECCOSTOCK? 0005
LAIRD吸收材料ECCOSTOCK? HiK500F
LAIRD吸收材料ECCOSTOCK? HiK
愛(ài)澤工業(yè)專(zhuān)業(yè)提供美國(guó)LAIRD吸收材料ECCOSTOCK? FFP，美國(guó)LAIRD全系列產(chǎn)品，LAIRD吸收材料，LAIRD微波材料，LAIRD低損耗點(diǎn)介質(zhì)材料等等。
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美國(guó)LAIRD吸收材料ECCOSTOCK? FFP
One part, epoxy based, free flowing powder典型參數(shù)特性
